Semiconductor Manufacturing
Accelerating Yield, Traceability, and Operational Intelligence for Advanced Packaging
Cantier’s MES X.0 is designed to support the complexities of semiconductor manufacturing with real-time intelligence, IIoT connectivity, and scalable architecture—transforming factories into smarter, more efficient operations.
Semiconductor OSAT (Outsourced Semiconductor Assembly and Test) facilities handle wafer singulation, die attach, wire bonding, molding, trimming, final test, and packing operations. The environment is high-volume, high-mix, often running 24/7 with stringent yield targets, tight cycle times, and multi-tier subcontracting.
These facilities depend on integration of test equipment, cleanroom operations, and multi-step process routing with constant recipe adjustments and engineering change controls.
Key Industry Challenges
Fragmented Lot-Level Traceability Across Complex Workflows
Challenge
Multiple process steps, retesting, and parallel routing complicate traceability and slow RCA (Root Cause Analysis).
Vision
Achieve real-time, die-level traceability with full route history, quality inspection records, and operator logs for instant product genealogy and audit-readiness
Variability in Equipment Performance and Process Quality
Challenge
Tool-to-tool variation and recipe drift affect yield stability across different test and packaging lines.
Vision
Enable predictive quality control and dynamic recipe enforcement by connecting test results with machine parameters and SPC analytics in real time.
Inflexible MES and Lack of Real-Time Production Visibility
Challenge
Rigid legacy systems lack agility to handle high product mix and engineering changes dynamically.
Vision
Implement a modular, AI-enabled MES that allows agile routing, operator guidance, and data-driven scheduling to optimize throughput and reduce turnaround time.
Cantier MES X.0 Industry Solutions & Features
Cantier’s MES X.0 brings high-performance, AI-ready execution orchestration to OSAT with:
End-to-End Lot & Die-Level Traceability
Track every movement, inspection, and result—automatically, in real-time.
Automated Recipe Control & Parameter Enforcement
Ensure exact specs by machine, tool, and lot with machine integration.
Integrated SPC & Yield Monitoring
Immediate alerts on anomalies and automated quality loop closure.
Dynamic Workflow and Retest Logic
Flexible lot movement and exception handling built into the platform.
Machine Connectivity via IIoT Gateways
Plug-and-play for test handlers, probers, pick-and-place, and molding machines.
Cantier Solution Suite for Semiconductor Manufacturing
Execution & Routing
Key Features:
Dynamic routing logic, retest flows, WIP visibility
Traceability
Key Features:
Lot-level and die-level trace with route, tool, and operator history
Quality & SPC
Key Features:
Inline SPC, test data integration, RCA tools, yield dashboard
AIoT Connectivity
Key Features:
Test handler data ingestion, recipe validation, predictive analytics
Scheduling & Dispatch
Key Features:
Automated lot dispatching, bottleneck analysis, and real-time decisioning
Engineering Change Control
Key Features:
Version-controlled work instructions and recipe management
Trusted by Industry Leaders
Powering precision, performance, and productivity across Semiconductor Manufacturing — here are just a few of the industry leaders we’re proud to work with.
